wire bonders attach a piece of semiconductor die onto its plastic or ceramic packaging. this is a very precision operation where, the package and die must line up to ensure a good electrical contact. using an image sensor to correctly position the die, the information from the sensor is sent along the lvds channel to a dsp. the dsp then sends the information to a die positioning table to line up the die and packaging. national offers a variety of precision operational amplifiers and dacs to handle this task. in addition power management, temperature sensors and operator display ensures that this task operates safely and efficiently.

component highlights

*lvds - high toggle rates allow serialization of large amounts of parallel data for efficient transmission over a single 100 ohm transmission line, with reduced emissions and drastically improved immunity to external interference.

*operational amplifiers - rail-to-rail input and output amplifiers maximize the signal range.

*d/a converter - with high resolution and sampling rates, dacs easily interface with microprocessors and ttl logic.

*ethernet - ethernet devices consume low power and are available in a wide range of speeds from 10/100 mb/s to 1gbps

1 power
lp2997
lp38691
lp38693

2 lvds
ds92lv1021a
ds92lv1023e
ds92lv1260

3 display
adcs9888cvh-170
adcs9888cvh-140

4 dac
dac081s101cimk
dac081s101cimkx
dac081s101cimm

5 amp
lmh6639
lmh6642
lmh6643

6 ethernet
dp83816avng

7 temp sensor
lm26
lm27

8 power
lm25005
lm25007
lm25010