EDA包括些什么?
发布时间:2007/4/23 0:00:00 访问次数:1935
Traditionally, electronic design automation (EDA) has been associated with IC design. The first tools were for transistor-level simulation;they evolved at Cal Berkeley to become Spice. The next class of tools were the computer-aided design (CAD) tools that helped designers interconnect the individual devices. Because these were the only tools available, CAD and EDA became synonymous with the IC design process.
This grouping of all EDA as IC design continues today. There are more than 150 IC design, verification and analysis tools in some companies, and the bulk of the EDA revenues come from the IC design sector. Although some add the additional category of computer aided manufacturing (CAM), that is more related to the actual manufacturing functions of running a factory.
The problem with this narrow definition of EDA is that it excludes some significant categories of tools. Electronic systems include many components besides ICs-there are printed-circuit boards, packaging, wiring and even software. To take the collection of components beyond the condition of a box full of parts, the manufacturing side must perform many assembly and test operations as well as test and analyze reliability and quality assurance.
As systems move through the continuum of processes of design and manufacturing, one of the important functions is the design for manufacturability (DFM) assessment. In the IC design phase, this review occurs after physical design in the parasitic extraction and analysis tools. The analysis may miss some important factors because the IC design process is fragmented into facets of consideration like timing, power, noise and reliability. The point tools that look at the various functions work in relative isolation.
At the pc-board level, the DFM analysis considers physical and electrical parameters like dimensions, noise and crosstalk, and device placement and placement order. This analysis phase starts to let the manufacturing considerations like vendor quality and delivery capabilities intrude into the review. A pc board might have a problem in manufacturing at one vendor, or some selected components may have unusual delivery or quality constraints. These constraints need to be addressed as early in the design&nb
Traditionally, electronic design automation (EDA) has been associated with IC design. The first tools were for transistor-level simulation;they evolved at Cal Berkeley to become Spice. The next class of tools were the computer-aided design (CAD) tools that helped designers interconnect the individual devices. Because these were the only tools available, CAD and EDA became synonymous with the IC design process.
This grouping of all EDA as IC design continues today. There are more than 150 IC design, verification and analysis tools in some companies, and the bulk of the EDA revenues come from the IC design sector. Although some add the additional category of computer aided manufacturing (CAM), that is more related to the actual manufacturing functions of running a factory.
The problem with this narrow definition of EDA is that it excludes some significant categories of tools. Electronic systems include many components besides ICs-there are printed-circuit boards, packaging, wiring and even software. To take the collection of components beyond the condition of a box full of parts, the manufacturing side must perform many assembly and test operations as well as test and analyze reliability and quality assurance.
As systems move through the continuum of processes of design and manufacturing, one of the important functions is the design for manufacturability (DFM) assessment. In the IC design phase, this review occurs after physical design in the parasitic extraction and analysis tools. The analysis may miss some important factors because the IC design process is fragmented into facets of consideration like timing, power, noise and reliability. The point tools that look at the various functions work in relative isolation.
At the pc-board level, the DFM analysis considers physical and electrical parameters like dimensions, noise and crosstalk, and device placement and placement order. This analysis phase starts to let the manufacturing considerations like vendor quality and delivery capabilities intrude into the review. A pc board might have a problem in manufacturing at one vendor, or some selected components may have unusual delivery or quality constraints. These constraints need to be addressed as early in the design&nb
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