583649-2详细规格
- 类别:卡边缘 - 触头
- 描述:CONT.CRP.SNAP TW.LF.STRIP
- 系列:TWIN LEAF
- 制造商:TE Connectivity
- 引脚或插座:无公形或母形之分
- 线规:18-22 AWG
- 触头端接:压接
- 触头材料:磷青铜
- 触头镀层:金
- 触头镀层厚度:15µin(0.38µm)
- 包装:带卷 (TR)
- 长方形 - 弹簧加载 Mill-Max Manufacturing Corp. 1206(3216 公制) CONN SPRING 18POS SNGL .410 SMD
- 其它 3M 1206(3216 公制) SURFACE CONDITION DISC TSM 2"
- 面板至面板 - 面板衬垫,堆叠器 TE Connectivity 1206(3216 公制) CONN HEADER 3POS .100" STACKER
- 矩形- 接头,公引脚 TE Connectivity CONN HEADER 4POS 5MM NATURAL TIN
- 长方形 - 弹簧加载 Mill-Max Manufacturing Corp. CONN SPRING 19POS SNGL .255 SMD
- 卡边缘 - 触头 TE Connectivity CONN CONTACT 28-24AWG CRIMP GOLD
- 触摸 Bourns Inc. SWITCH TACTILE SPST-NO 0.1A 24V
- 矩形- 接头,公引脚 TE Connectivity CONN HEADER 12POS VERT TIN .100
- 其它 3M SURFACE CONDITION DISC TSM 2"
- 长方形 - 弹簧加载 Mill-Max Manufacturing Corp. CONN SPRING 22POS SNGL .255 SMD
- 面板至面板 - 面板衬垫,堆叠器 TE Connectivity CONN HEADER 8POS .100" STACKER
- 触摸 Bourns Inc. SWITCH TACTILE SPST-NO 0.1A 24V
- 矩形- 接头,公引脚 TE Connectivity CONN HDR 5POS VERT KEY-X 15GOLD
- 其它 3M SURFACE CONDITION DISC TSM 3"
- 屏蔽包,材料 Desco BAG EMI/RFI MVB 6MIL 10X24