1733570详细规格
- 类别:接线板 - 线至板
- 描述:TERMINAL BLOCK 2POS 5.08MM GRN
- 系列:COMBICON SMKDSP
- 制造商:Phoenix Contact
- 级别数:1
- 每级针脚数:2
- 间距:0.200"(5.08mm)
- 配接方向:35°(145°)角度,带板
- 电流:15A
- 电压:300V
- 线规:14-30 AWG
- 安装类型:通孔
- 电线端接:螺钉 - 提升笼式夹
- 特性:联锁(侧面)
- 颜色:绿
- 包装:散装
- 通孔电阻器 TE Connectivity 轴向 RES 30.1K OHM 1/2W 0.1% AXIAL
- 存储器 Microchip Technology 8-WFDFN 裸露焊盘 IC SRL EEPROM 2KX8 2.5V 8-TDFN
- 矩形 - 外壳 TE Connectivity 8-WFDFN 裸露焊盘 070 MLC W-W PLUG HSG 15P GREEN
- 接线板 - 线至板 Phoenix Contact 8-WFDFN 裸露焊盘 TERMINAL BLOCK 2POS 5MM GRN
- 连接器,互连器件 TE Connectivity 8-WFDFN 裸露焊盘 CONN PLUG PIN 7POS SLD CUP STR
- 配件 Weidmuller 8-WFDFN 裸露焊盘 TIP PEN PERMANENT AMS .50MM
- 光纤 TE Connectivity 8-WFDFN 裸露焊盘 CA 2MM OFNR 62.5/125,LC SEC YEL
- 通孔电阻器 TE Connectivity 轴向 RES 287K OHM 1/2W 0.1% AXIAL
- 存储器 Microchip Technology 8-TSSOP(0.173",4.40mm 宽) IC SRL EEPROM 2KX8 2.5V 8-TSSOP
- 用于 IC 的插座,晶体管 Mill-Max Manufacturing Corp. 8-TSSOP(0.173",4.40mm 宽) IC SOCKET 24PIN CLOSED FRAME SMD
- 矩形 - 外壳 TE Connectivity 8-TSSOP(0.173",4.40mm 宽) 070 MLC CAP HSG 6P BLUE
- 光纤 TE Connectivity 8-TSSOP(0.173",4.40mm 宽) CA 2MM OFNR 62.5/125,LC SEC YEL
- 配件 Weidmuller 8-TSSOP(0.173",4.40mm 宽) TIP PEN PERMANENT AMS .18MM
- 存储器 Microchip Technology 8-SOIC(0.154",3.90mm 宽) IC EEPROM 16KBIT 2MHZ 8SOIC
- 通孔电阻器 TE Connectivity 轴向 RES 324K OHM 1/2W 0.1% AXIAL