The Commitment to Advanced Packaging in China
发布时间:2008/6/5 0:00:00 访问次数:420
——apia development center to open in shanghai | |||
by ellery buchanan | |||
| china is recognized globally as a dynamic and coveted market with vast potential in numerous industries, including our own semiconductor industry. in 2001, china accounted for 10% of the global foundry capital spending. that doubled to 20% in 2002. beijing and shanghai are rapidly becoming the new manufacturing center for the ic industry, with eleven new fabrication facilities underway. according to market research company isuppli corp., china accounted for 10% of the $20 billion global packaging market in 2001 as well. with china’s packaging cagr forecast at 26% according to isuppli, china is fast becoming a global powerhouse. the advanced packaging and interconnect alliance (apia) is an association of over 30 leading equipment and process material companies focused on accelerating the development and implementation of commercially viable, comprehensive and risk-free advanced packaging solutions. formed in 2001, the apia concentrates on enhancing the productivity of the equipment and process solutions critical to addressing the challenges of creating high performance, low cost packaging for rapidly evolving semiconductor devices. within months of its formation, the apia began to concentrate on establishing a leading position in china. apia sponsored educational and promotional tours were followed by comprehensive member delegations intent on forging mutually beneficial relationships with the enlightened political and business leaders in china. during this process,ace semiconductor (shanghai) co., ltd., a full service testing and advanced packaging foundry with grand plans based in the zhangjiang semiconductor industrial park, emerged as an energetic partner intent on implementing innovative solutions. this led to the creation of the apia advanced packaging development center due to open early this summer. the apia advanced packaging development center features state of the art manufacturing capability with careful attention to equipment selection for the various process steps. both flip chip and wafer level packaging technologies are gaining widespread acceptance with the increase in complexity of devices and the adoption of systems-in-package techniques. while the growth in liquid crystal display (lcd) panels has propelled the demand for gold bumping activity, the need for advanced microprocessors and logic devices with improved electrical characteristics has resulted in increased solder bumping applications. this development center is capable of addressing the most stringent process requirements for gold bump, solder bump and wafer level chip scale packaging. the installation of the 200 mm advanced packaging line at ace in shanghai provides the apia and their asian customers with critical development and support resources required to accelerate the adoption of advanced packaging. the long tradition of apia advanced packaging seminars continues with a ground breaking joint apia/semi advanced packaging seminar held in conjunction with this month’s semicon china trade show. at this event, an apia presentation will focus on procedures for use of the new 200mm development center. potential customers are invited to visit the development center for either equipment or material demonstrations, or to develop new processes. visits and projects can be scheduled by contacting any of the participating apia members or by visiting the apia web site at www.apialliance.com. the dedication and focus by apia on the china market is only beginning. the members view the development center as simply indicative of their commitment to the market. new support tools and materials are constantly bein
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